Packaging of electronic and photonic devices

Packaging of electronic and photonic devices

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(3C) Time-Dependent Shear Stress The shear-stress history at the center of solder joints made by the 62Sn36Pb2Ag, ... 2 ANSYS input for implicit creep analysis (Creep Model 8) Note: T is absolute temperature in AdK. (For ANSYS Releaseanbsp;...

Title:Packaging of electronic and photonic devices
Author: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Publisher:Amer Society of Mechanical - 2000-12

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